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The 42nd ISSE, May 15–19, 2019, Wrocław, Poland

Updated: Sep 8, 2021

Syswin Solutions’ continuous collaboration with academia was pointed out by the presentation of two scientific papers.

I. Mechanical vs Electrical Properties of Conductive Adhesive Bonds as Function of Operating Temperature Authors: Mihai Branzei1), Paul Mugur Svasta2), Marian Vladescu2), Ioan Plotog2), Bogdan Mihailescu2), Gaudentiu Varzaru 1) Faculty of Material Science and Engineering, 2) Faculty of Electronics, Telecommunications and Information Technology, University POLITEHNICA of Bucharest Solderless assembly for electronics is a subject approached ever since RoHS EU Directive enforced lead-free technology especially since this one has revealed its limits. Electrically Conductive Adhesives actually with a large commercial offer but not very well characterized, became one of the alternatives to lead-free.

The paper presents Electrically Conductive Adhesives qualification methods from mechanical and electrical properties point of view for usage as promising solution to build the electronic module, optimum on Surface Mount Technology processes or in the Occam concept using an additive process for interconnection structure. For a complete information about the bonds mechanical failure and their electrical resistance, shear tests, respectively four point electrical measurements were performed.

II. Thermal Investigations on Modules Realized Using Solderless Assembly for Electronics Technology Authors: Ciprian Ionescu 1), Mihai Branzei 2), Norocel Codreanu 1), Gaudentiu Varzaru 1) Faculty of , Electronics, Telecommunications and Information Technology 2) Faculty of Material Science and Engineering, University POLITEHNICA of Bucharest This work continues our investigation regarding the philosophy and the implementation of a new technology entitled Solderless Assembly for Electronics Technology or Occam. There are presented the results of thermal analysis and measurements of electronic circuits, realized in Occam technology, compared to “classical” electronic modules realized on FR4.

In the first case the convection from the top of component is blocked by the molding process. In the second case, free convection from top of component is considered. In both cases, the interconnection of components should be realized using printed conductive paste, as in the modified variant proposed in a previous work. In this way, the heat generation in electronic components, in our case mid power LEDs, will be added with the supplemental dissipation caused by the current flow. For comparison purposes, there were investigated structures containing fixed linear resistors and/or structures printed on flat substrates.

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