Syswin Solutions at the International Conference EMPC 2025

Between September 16–18, Syswin Solutions participated in a prestigious event – the 25th European Microelectronics & Packaging Conference (EMPC 2025), hosted at the World Trade Center in Grenoble, France.

EMPC 2025 is the leading international conference dedicated to electronic and microelectronic packaging, organized and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS. This year’s edition brought together 442 participants from 31 countries, with Romania ranking 10th in terms of representation.

During the event, in Poster Session 2, Gaudențiu Vărzaru presented the paper “Thermal Management of an Electronic Module Made by a Solderless Assembly”, authored by G. Vărzaru, Roxana Tulea, M. Moise, M. Brânzei, and P. Svasta. The work is the result of a scientific collaboration between Syswin Solutions and the National University of Science and Technology Politehnica Bucharest.

Syswin Solutions places great emphasis on collaboration with academia and research institutions in order to develop innovative solutions in the fields of IoT and M2M.