Syswin Solutions – again present at the SIITME International Conference and Exhibition (31st edition, 2025)

Between October 22 and 25, 2025, in Brașov, the IEEE 31st INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONICS PACKAGING (SIITME) took place, organized by the Transilvania University of Brașov. Syswin Solutions participated in both sections. During the Conference, Gaudențiu Vărzaru presented the paper „A Comparative Study of Some Soil Fertility Sensors Based on Electrical Conductivity Measurements”, by Gaudențiu Vărzaru, Roxana Tulea, Răzvan Ungurelu, Viorel Fătu, Paul Svasta. The paper was presented at the Poster Section. During the Exhibition, Syswin Solutions presented and explained to the visitors present at the company's stand the benefits that electronics and IT bring to agriculture, using his successful projects, SysAgria and SYCPE, as case studies.