The Industrial Workshop was moderated by Cosmin Moisa and Stefan Techau. Yours truly is shown discussing my disruptive solderless Occam technology
The 23rd annual IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) was held in Constanta, Romania, October 26-29, 2017. It attracted more than 190 participants from Romania and 13 other counties. While there might be some who question the suitability of Romania as a venue for such a conference, the country has a long technological history and has produced some top innovators and pioneers in aviation including Aurel Vlaicu, Traian Vuia, Henri Coanda (who prototyped an early jet aircraft in 1910), and great engineers like Anghel Saligny, and George Constantinescu, a pioneering scientist credited with developing the theory of sonics.
The convention was created to bring together members of the electronic packaging community from near and far to discuss technology developments and needs. Ongoing efforts by the organizers have been intensified over the last decade in their effort to bring together academia and industry to share knowledge and experiences. The SIITME conference creates a shared environment where students, teachers, and senior researchers present their latest works and interact with industry representatives who highlight the state-of-the-art in the industry.
As Professor Dan Pitica of the Technical University of Cluj Napoca, Romania, observed, “SIITME is more than just a conference. The Association for Promoting Electronics Technology, APTE, succeeded in bringing together eight top international professionals to give keynote talks including Klaus-Jurgen Wolter (Technische Universitat Dresden, Germany), Gheorghe Brezeanu (Politehnica University of Bucharest, Romania), Stefan Techau (ASM Assembly Systems GmbH & Co KG), Frederic Kratz (National Institut of Applied Sciences INSA, Centre Val de Loire, France), Joseph Fjelstad (Verdant Electronics, USA), Jose Sartori (OSRAM Opto Semiconductors), Etienne Sicard (INSA Toulouse, France), Radu Sporea (Advanced Technology Institute, University of Surrey, Guildford, UK), and many specialists from Continental Automotive, Tecnometal (Italy), ES Srl Electronic Solution (Italy), SEM Communication & GEST Labs SRL (Italy), Contest, Miele Tehnica, NTT Data.”
Occam was one topic that generated a good deal of discussion.
Gaudentiu Varzaru presenting CETTI’s first trials in Occam technology
The exhibition took place in parallel with the conference.
Discussions took place during the poster sessions.
To focus on the future, the first day of the event was dedicated to the Industrial Workshop “Advanced Interconnection and Disruptive Technologies, Debate for the Future Sustainable Electronics Packaging.” This event was moderated by industry representatives Cosmin Moisa, Continental Automotive Romania; Stefan Techau; Paul Svasta, University Politehnica of Bucharest; and myself. Topics included the reliability challenge for the electronic products, front-end assembly capability, managing PCB supplier challenges, and CETTI’s early steps in exploring Occam technology were also discussed.
Award winners were selected by organizers Professor Paul Svasta (far right) and Associate Professor Mihaela Hnatiuc (second from right). Alexandra Fodor (Technical University of Cluj Napoca), the winner of Best Poster Award, stands between Iulian Nastac (far left) and Andrei Drumea (middle, Politehnica University of Bucharest), who also received recognition for their excellent poster efforts.
The final two days were divided between keynote speeches, industrial sessions, plenary oral and poster sessions. The works judged best of the show were awarded honorary certificates. The objective of creating a forum for close industry-university links is to harmonize the training of the human resource with an eye to meeting the near and future requirements of the industry. Industry participants accounted for nearly 40% of attendees, a number of whom presented papers of their scientific or industrial research work, including Continental Automotive Romania, BEIA Consult, and Syswin Solutions.
The latter two companies are members of the Electronic Innovative Cluster, ELINCLUS, who, together with other companies, presented at the exhibition section. They are prime examples of the continuous effort of the Cluster’s management entity, APTE, to help to promote the interests of their members, specifically, facilitating contacts, promoting research results, products and services on an international level. The local organizing committee, headed by Associate Professor Mihaela Hnatiuc from Constanta Maritime University, has made a significant effort to help in the success of the conference, including by facilitating a visit through the institution’s laboratories.
During the closing ceremony, the general chair, Professor Paul Svasta, emphasized that the SIITME 2017 event was the largest event yet and attracted the most diverse group to date. In closing, Professor Daniela Tarniceriu, Dean of the Faculty of Electronics, Telecommunication and Information Technology from Gheorghe Asachi Technical University of Iasi, and Marian Petrescu, Continental Automotive Romania, SIITME Conference, and Exhibition committee member, announced that the next event, SIITME 2018, will be held in Iasi, one of the most beautiful cities in Romania, and one of the four cities where Continental Automotive chose to set up operations. Surely, not accidentally.
Autor: Joe Fjelstad, VERDANT ELECTRONICS
