Components’ assembly and interconnection through combined solderless technologies – COMPACT

Project general information

Project: Components’ assembly and interconnection through combined solderless technologies – COMPACT

Finaciar support: The Executive Unit for Financing Higher Education, Research, Development and Innovation (UEFISCDI); European Commission through ERANET MANUNET programme

Project type: ERANET

Contract number: 153/2020

Period: 2020 – 2022


COMPACT project aims to develop a new manufacturing technology method to build electronic modules without

using solder alloy, but materials like conductive paste or ink, resin, electroless copper. The proposed technology might allow to manufacture cheaper and more reliable electronic modules since all the problems caused by the solder joints (defects like cracking, whiskers, tombstoning, voiding, a.s.o.), and by the process (delamination, higher thermal stress of the components), will disappear.

COMPACT involves less energy Consuming processes thus contributing to the environment protection. In order to achieve its objectives, COMPACT combines two processes, the printed circuit board fabrication and the electronic components assembly, into one in which the electronic module is built layer by layer, electronic components placement and interconnection structure, by using other processes (e.g:printing, curing, encapsulation, copper deposition) with existing equipment. COMPACT allows to get robust electronic modules, fully protected to dust, chokes and humidity. It is expected that the first applications will be for harsh environments, underground (traffic/parking sensors), navy, space.


Syswin Solutions SRL, Romania

Politehnica University from Bucharest, Center for Electronic Technology and Interconnection Techniques, UPB-CETTI, Romania

TacticaTIC, Spain.


(in construction)


The kick-off meeting of the project took place online on May 6, 2020. Participants:

PhD. Ana Maria Paraschiv,  Gaudentiu Varzaru, Hannelore Valkanova, PhD. Rosemari Kiss, Adrian Zarnescu, Razvan Ungurelu, Ileana Damian (Syswin Solutions);

PhD. Prof. Ciprian Ionescu, PhD. Lecturer Bogdan Mihailescu, PhD. Assoc. Prof. Mihai Branzei, PhD. Prof. Paul Svasta, PhD. Lecturer Mihaela Pantazica, Cristina Lepadatu (UPB-CETTI);

Isabel Santos, David Lopez Alonso (TacticaTIC);

PhD.Marin Gheorghe (NANOM-MEMS).

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