Syswin Solutions honored the Jubilee Edition of the SIITME Conference by presenting his recent scientific work performed within the company and in collaboration with academia.
Controlling the Temperature and Humidity in a Greenhouse
Authors: Adrian Zărnescu, Răzvan Ungurelu, Gaudențiu Varzaru
Traditionally, the control of the temperature and humidity in a greenhouse is based on the exchange of air masses between its interior and exterior, either by ventilation (curtains), either by circulation (fans). While might be cost and energy efficient solutions, a curtain system requires a certain amount of maintenance to keep it operating, and the efficiency of the control depends on other air parameters, like speed and direction of the wind. Modern solutions are based on water vaporization under high pressure. In terms of control, a known solution is based on the difference between the temperature and humidity levels outside the greenhouse, and the temperature and humidity inside the greenhouse. However, vaporisation methods are known to be prone to condesation under the roof or on the leaves of the plants, which is favorable to the production of spores, increased fungal growth, presence of foliar diseases. The novelty of the solution is the control of the generator of the vapours based on air temperature inside the greenhouse and the information from a leaf wetness sensor. The solution was implemented and tested in a greenhouse last summer.
Electrically Conductive Paste Printed Volume Influence on Bonds Properties
Authors: Mihai Branzei1), Gaudențiu Varzaru, Marian Vladescu2), Bogdan Mihailescu2), Ioan Plotog2)
1) Faculty of Material Science and Engineering, 2) Faculty of Electronics, Telecommunications and Information Technology, University POLITEHNICA of Bucharest
The paper presents the investigations of bonds mechanical and electrical properties function of electrically conductive paste printed volumes. For the experiments, it was taken into consideration the SW180 electrically conductive paste type which was used only for bonding chip resistors on the pads of interconnection structure having electroless Nickel immersion Gold (ENIG) finishing. The test vehicles contain a daisy-chain structure with ten 0 Ω resistors, 2512 case. The printed volume was controlled by the stencil thickness (100/150 μm). The mechanical tests (shear test) had been performed at five different temperatures (298/323/348/373/398 K) and they had been completed with electrical measurements and microstructural analysis.POSTER_SIITME_2019